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QFN-24, 4mm x 4mm, 0.5mm Pitch, SMD to DIP Adapter

MPN: ST-QFN-24-4X4-05

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Downloads Datasheet download
Mechanical Drawing download
3D Model (STEP) download

  • Converts a QFN 24-Pin SMD part to a DIP form factor
  • High quality PCB can withstand re-work
  • Enables SMD parts to be used with a breadboard
  • 0.1" pitch holes for standard headers
DIP Pitch:0.1"
SMD Package:QFN-24
SMD Size:4mm x 4mm
SMD Pitch:0.5mm
Surface Finish:ENIG
Temperature Rating:-30°C to +110°C

WARNING: California Prop 65

This SMD to DIP breakout board enables the easy conversion of a surface mount package to a DIP form factor. This adapter makes prototyping with surface mount parts fast and easy. Through-holes with a standard 0.1" pitch allow the board to work with common headers and enable SMD parts to be used in breadboards and perfboards. This board has an ENIG surface finish and is made of high quality FR4 which can withstand high temperature soldering and re-work. Besides the standard pins, this board also breaks out the bottom pad of a QFN part. This pad is connected to one through-hole on each side of the board labeled "PAD", it is also routed to a centered through-hole for quick access. The QFN bottom pad is connected through to the back side of the adapter to make soldering easier.

Mechanical Drawing